Resist stripper / Post-etch residue remover "JELK Series"
NMP-free resist stripping solution. Suitable for thick film resist stripping during bump formation!
It has a higher stripping capability than general amine-based stripping solutions and can be applied to alkaline development type negative resists and thick dry film resists. Additionally, it causes minimal damage to various metal materials and can also be applied to the lift-off process of Al-Cu electrodes. Furthermore, it can be used as a residue removal solution after Al dry etching. 【Features】 ■ It can strip resists and dry film resists that are difficult to remove with conventional amine-based stripping solutions, especially after ion implantation. ■ It does not contain hydroxylamine or NMP. ■ IPA rinsing is not required, allowing for use with only water rinsing. *For more details, please feel free to contact us.
